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physical vapor deposition(PVD), includes Sputter deposition, Cathodic Arc Deposition,Pulsed laser deposition and others, used to describe any of a variety of methods to deposit thin films by the condensation of a vaporized form of the material onto various surfaces . The term physical vapor deposition appears originally in the 1966 book Vapor Deposition by CF Powell, JH Oxley and JM Blocher Jr.
Ion Plating is a physical vapor deposition(PVD) process .The traditional surface finishing processes includes electrophoretic deposition(EPD),mechanical plating and etc., which have disadvantages such as poor adhesive and polluting the environment.However,The new technique--ion plating process overcomes all these shortcomings. It can make high quality coating such as TiN, TiNC, TiC, ZrN, TiAlN, CrN and many others in non-pollution process. These coatings can be employed to:improve appearance,adhesion,soderability,corrosion resistance,tarnish resistance,hardness and etc.The ion plating process was first described in the technical literature by Donald M. Mattox of Sandia National Laboratories in 1964.
Cathodic arc deposition is one of the physical vapor deposition method to fulfil Ion plating process.In this way,an electric arc is used to vaporize material( titanium for example) from a cathode target into plasma. The plasma then will be accelerated by the application of an electromagnetic field and reacts with inert (N2 for example)or reactive gas. Next, the compound ( TiN etc.) deposits on the workpieces.Changing coating material or gas that is introduced in so that different films can be made to meet customers' needs.TiN for color of golden, TiC for gun black, ZrN for brass and TiCN for rose gold and etc.Industrial use of modern cathodic arc deposition technology originated in Soviet Union around 1960–1970.
The plasma beam from Cathodic Arc source contains some larger clusters of atoms or molecules (so called macro-particles), which prevent it from being useful for some applications without some kind of filtering. There are many designs for macro-particle(droplets) filters and the most studied design is a quarter-torus duct bent at 90 degrees from the arc source and the plasma is guided out of the duct by principle of plasma optics.We can also offer some other kinds of filter as optional.
The arc has an extremely high power density resulting in a high level of ionization (30-100%) which results in high quality coating.
The arc tagets can be placed in either horizontal or vertical way, so large coating systems can be easily made by adding more targets.
As coating work duration is short and coating system can be very large, The arc technique is the most efficient vacuum coating method that becomes the first choice of industry production. The key technology in manufactory of arc coating systems are vacuum, power(especially bias power), control, targets and.
As a coating system producer, the main advantages of Sinoarc are power and control part, along with targets. Systems for tools coating applied by Sinoarc® is a method of infinitive businese value. The high-qualified film we offer as well for bathroom hardwares is standing at the leading place in the field.
Applications:
Tools coating: Cathodic arc deposition is actively used to synthesize extremely hard film to protect the surface of cutting tools and extend their life significantly. A wide variety of thin hard-film, Superhard coatings and nanocomposite coatings can be synthesized by this technology including TiN, TiAlN, CrN, ZrN, AlCrTiN and TiAlSiN.
Decorative coating:
Architecture: Bathroom hardware(faucet),locks, door handles, furniture
Watch Industry: watch cases, watch bands,watch hands
Other Hardwares: hardwares for leather, spectacle frames, stainless steel
Large Workpieces: stainless steel sheet
Sputter deposition is a physical vapor deposition (PVD) method of depositing thin films by sputtering.An important advantage of sputter deposition is that even materials with very high melting points are easily sputtered while evaporation of these materials in targets.In addition Sputtered films typically have a better adhesion on the substrate than evaporated films.
Applications:
sputter is used extensively in the semiconductor industry to deposit thin films of various materials in integrated circuit processing. Thin antireflection coatings on glass for optical applications are also deposited by sputtering. Since the low substrate temperatures used, sputtering is an ideal method to deposit contact metals for thin-film transistors. Sputtering is also used to metalize plastics such as snack bags. Sputtering is also used as the process to deposit the metal (e.g. aluminium) layer during the fabrication of CD and DVD discs. Hard disk surfaces use sputtered CrOx and other sputtered materials. Sputtering is one of the main processes of manufacturing optical waveguides and is another way for making efficient photovoltaic solar cells as well.
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